SS

Shigeo Sase

HC Hitachi Chemical Company: 10 patents #148 of 1,946Top 8%
PC Pacific Industrial Co.: 1 patents #64 of 133Top 50%
📍 Chikusei, JP: #25 of 185 inventorsTop 15%
Overall (All Time): #521,514 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Showing 1–10 of 10 patents

Patent #TitleCo-InventorsDate
7392694 Tire condition monitor device and method of manufacturing the same Satoshi Morita, Akira Momose, Naoki Hara 2008-07-01
6696155 Prepreg for printed wiring boards, resin varnish, resin composition and laminate for printed wiring boards produced by using these substances Nozomu Takano, Tomio Fukuda, Michitoshi Arata 2004-02-24
6692792 Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances Nozomu Takano, Tomio Fukuda, Michitoshi Arata 2004-02-17
6572968 Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards Nozomu Takano, Tomio Fukuda, Michitoshi Arata 2003-06-03
6465083 METHOD OF MAKING VARNISH OF MODIFIED CYANATE ESTER GROUP CURABLE RESIN COMPOSITION, AND PREPREG, METAL CLAD LAMINATED BOARD, FILM, PRINTED CIRCUIT BOARD, AND MULTILAYERED CIRCUIT BOARD USING THE COMPOSITION Yasuyuki Mizuno, Takeshi Sugimura, Harumi Negishi 2002-10-15
6329474 Epoxidized phenol-hydroxybenzaldehyde condensate, bisphenol-formaldehyde condensate and masked imidazole Michitoshi Arata, Nozomu Takano, Tomio Fukuda 2001-12-11
6180250 Epoxy composition for printed circuit boards Michitoshi Arata, Nozomu Takano, Tomio Fukuda 2001-01-30
6156831 Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same Yasuyuki Mizuno, Takeshi Sugimura, Harumi Negishi 2000-12-05
4362203 Process for preparing foundry cores or molds and binder materials used therefor Susumu Konii, Masatoshi Yoshida, Shoei Kuroda, Takeshi Sumi 1982-12-07
4283319 Process for preparing foundry cores or molds and binder materials used therefor Susumu Konii, Masatoshi Yoshida, Shoei Kuroda, Takeshi Sumi 1981-08-11