Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11930594 | Adhesive film for multilayer printed-wiring board | Aya Kasahara, Hikari Murai | 2024-03-12 |
| 11432400 | Interlayer insulating film and method for producing same | Masaharu Matsuura, Nobuyuki Ogawa, Shin Takanezawa | 2022-08-30 |
| 11359055 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Tomio Fukuda, Yuki Nagai, Hikari Murai | 2022-06-14 |
| 11041045 | Resin composition, prepreg, laminate and multilayer printed wiring board | Yuki Nagai, Tomio Fukuda, Takao Tanigawa, Hikari Murai | 2021-06-22 |
| 10519279 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Tomio Fukuda, Yuki Nagai, Hikari Murai | 2019-12-31 |
| 10251265 | Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board | Akiko Kawaguchi, Nozomu Takano, Kazumasa Takeuchi, Shigeru Haeno, Yoshinori Nagai +1 more | 2019-04-02 |
| 9828466 | Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same | Tomio Fukuda, Takao Tanigawa, Yuki Nagai, Hikari Murai | 2017-11-28 |
| 9397381 | Electromagnetic coupling structure, multilayered transmission line plate, method for producing electromagnetic coupling structure, and method for producing multilayered transmission line plate | Yuusuke Kondou, Etsuo Mizushima, Yasushi Watanabe | 2016-07-19 |
| 8568891 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Daisuke Fujimoto, Kazutoshi Danjobara, Hikari Murai | 2013-10-29 |
| 8501870 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Daisuke Fujimoto, Kazutoshi Danjobara, Hikari Murai | 2013-08-06 |
| 8404769 | Process for producing resin varnish containing semi-IPN composite thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate | Daisuke Fujimoto, Kazutoshi Danjoubara, Hikari Murai | 2013-03-26 |
| 8277948 | Thermosetting resin composition of semi-IPN composite, and varnish, prepreg and metal clad laminated board using the same | Daisuke Fujimoto, Kazutoshi Danjobara, Hikari Murai | 2012-10-02 |
| 7816430 | Composition of polycyanate ester and biphenyl epoxy resin | Daisuke Fujimoto, Hiroshi Shimizu, Kazuhito Kobayashi, Takayuki Sueyoshi | 2010-10-19 |
| 7157506 | Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate | Daisuke Fujimoto, Kenichi Tomioka, Nozomu Takano | 2007-01-02 |
| 7078106 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Kazuhito Kobayashi, Daisuke Fujimoto, Nozomu Takano | 2006-07-18 |
| 6667107 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Kazuhito Kobayashi, Daisuke Fujimoto, Nozomu Takano | 2003-12-23 |
| 6465083 | METHOD OF MAKING VARNISH OF MODIFIED CYANATE ESTER GROUP CURABLE RESIN COMPOSITION, AND PREPREG, METAL CLAD LAMINATED BOARD, FILM, PRINTED CIRCUIT BOARD, AND MULTILAYERED CIRCUIT BOARD USING THE COMPOSITION | Shigeo Sase, Takeshi Sugimura, Harumi Negishi | 2002-10-15 |
| 6156831 | Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same | Shigeo Sase, Takeshi Sugimura, Harumi Negishi | 2000-12-05 |
| 5492589 | Decorative laminated sheet having a feeling of coating and a process for producing same | — | 1996-02-20 |
| 5413840 | Decorative laminated sheet having a feeling of coating and a process for producing same | — | 1995-05-09 |