Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11553593 | Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board | Takayuki Suzukawa, Ikuo Sugawara, Tetsurou Irino, Yuuki Tezuka | 2023-01-10 |
| 11432400 | Interlayer insulating film and method for producing same | Nobuyuki Ogawa, Shin Takanezawa, Yasuyuki Mizuno | 2022-08-30 |
| 10968135 | Lead-free glass composition, and glass composite material, glass paste, and sealing structure body containing the same | Takashi Naito, Taigo ONODERA, Tatsuya Miyake, Akitoyo Konno, Shinichi Tachizono +3 more | 2021-04-06 |
| 10645804 | Adhesive film, multilayer printed wiring board using adhesive film, and method for manufacturing multilayer printed wiring board | Nobuyuki Ogawa, Hiroaki Fujita, Hiroyuki Fukai | 2020-05-05 |
| 7588835 | Method of treating the surface of copper and copper | Tomoaki Yamashita, Yasuo Inoue, Toyoki Ito, Akira Shimizu, Fumio Inoue +1 more | 2009-09-15 |