Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11553593 | Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board | Takayuki Suzukawa, Ikuo Sugawara, Yuuki Tezuka, Masaharu Matsuura | 2023-01-10 |
| 10957964 | Multilayer transmission line plate | Takao Tanigawa, Yuusuke Kondou, Etsuo Mizushima, Tomio Fukuda, Yuki Nagai | 2021-03-23 |
| 10544305 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same | Aya Kasahara, Hikari Murai | 2020-01-28 |
| 10506705 | Multilayer transmission line plate | Yuusuke Kondou, Etsuo Mizushima, Takao Tanigawa, Yuki Nagai, Tomio Fukuda | 2019-12-10 |
| 10119047 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same | Tomohiko KOTAKE, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa +1 more | 2018-11-06 |