Issued Patents All Time
Showing 1–25 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11930594 | Adhesive film for multilayer printed-wiring board | Aya Kasahara, Yasuyuki Mizuno | 2024-03-12 |
| 11780735 | Aerogel composite, and supporting member and heat insulation material provided with aerogel composite | Tomohiko KOTAKE, Masato Miyatake | 2023-10-10 |
| 11401381 | Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same | Tomohiko KOTAKE, Masato Miyatake, Shunsuke Nagai, Shintaro Hashimoto, Yasuo Inoue +1 more | 2022-08-02 |
| 11359055 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai | 2022-06-14 |
| 11333288 | Aerogel laminate and thermal insulation material | Tomohiko KOTAKE, Masato Miyatake, Chisato KIKKAWA, Hiroyuki Izumi | 2022-05-17 |
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Takao Tanigawa, Tetsuroh Irino, Yuusuke Kondou, Yuichi Shimayama, Etsuo Mizushima +2 more | 2022-03-29 |
| 11220579 | Sol composition | Tomohiko KOTAKE, Masato Miyatake | 2022-01-11 |
| 11117353 | Production method for aerogel laminate, and aerogel laminate roll | Tomohiko KOTAKE, Masato Miyatake, Chisato KIKKAWA, Hiroyuki Izumi | 2021-09-14 |
| 11041045 | Resin composition, prepreg, laminate and multilayer printed wiring board | Yuki Nagai, Yasuyuki Mizuno, Tomio Fukuda, Takao Tanigawa | 2021-06-22 |
| 10738165 | Aerogel | Tomohiko KOTAKE, Masato Miyatake | 2020-08-11 |
| 10590001 | Aerogel composite, and supporting member and heat insulation material provided with aerogel composite | Tomohiko KOTAKE, Masato Miyatake | 2020-03-17 |
| 10563016 | Aerogel | Tomohiko KOTAKE, Masato Miyatake | 2020-02-18 |
| 10556405 | Production method for aerogel laminate, and aerogel laminate roll | Tomohiko KOTAKE, Masato Miyatake, Chisato KIKKAWA, Hiroyuki Izumi | 2020-02-11 |
| 10544305 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same | Aya Kasahara, Tetsurou Irino | 2020-01-28 |
| 10519279 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai | 2019-12-31 |
| 10465089 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Shin Takanezawa, Yasuo Inoue, Kazunaga Sakai | 2019-11-05 |
| 10414943 | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate | Yoshihiro Takahashi, Yasuo Kamigata, Masahiro Aoshima, Shinji Tsuchikawa, Masato Miyatake +2 more | 2019-09-17 |
| 10323126 | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package | Tomohiko KOTAKE, Shunsuke Nagai, Shintaro Hashimoto, Shinichiro Abe, Masato Miyatake +1 more | 2019-06-18 |
| 10119047 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same | Tomohiko KOTAKE, Shinji Tsuchikawa, Hiroyuki Izumi, Masato Miyatake, Shin Takanezawa +1 more | 2018-11-06 |
| 9873771 | Film-like epoxy resin composition, method of producing film-like epoxy resin composition, and method of producing semiconductor device | Yutaka Nomura, Yusuke WATASE, Hirokuni Ogihara, Norihiko Sakamoto, Daisuke Fujimoto | 2018-01-23 |
| 9828466 | Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same | Yasuyuki Mizuno, Tomio Fukuda, Takao Tanigawa, Yuki Nagai | 2017-11-28 |
| 9265145 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Shin Takanezawa, Yasuo Inoue, Kazunaga Sakai | 2016-02-16 |
| 9133308 | Resin composition, and printed wiring board, laminated sheet, and prepreg using same | Shunsuke Nagai, Masato Miyatake, Tomohiko KOTAKE, Shintaro Hashimoto, Yasuo Inoue +1 more | 2015-09-15 |
| 9101061 | Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate | Masahiro Aoshima, Yoshihiro Takahashi, Yuka Yamazaki, Yasuo Kamigata | 2015-08-04 |
| 9079376 | Prepreg, laminate obtained with the same and printed-wiring board | Tomohiko KOTAKE, Masato Miyatake, Shunsuke Nagai, Hiroyuki Izumi, Shinji Tsuchikawa +1 more | 2015-07-14 |