Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10465089 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Hikari Murai, Shin Takanezawa, Yasuo Inoue | 2019-11-05 |
| 9265145 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Hikari Murai, Shin Takanezawa, Yasuo Inoue | 2016-02-16 |
| 9078365 | Resin composition, prepreg, laminate, and wiring board | Koji Morita, Shin Takanezawa, Yuusuke Kondou | 2015-07-07 |