Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12324105 | Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package | Chihiro Hayashi, Minoru Kakitani, Ryuji Akebi, Naoyoshi Sato, Akira Horie | 2025-06-03 |
| 12024624 | Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package | Naoyoshi Sato, Shuji Gozu, Minoru Kakitani, Ryuji Akebi, Chihiro Hayashi | 2024-07-02 |
| 11745482 | Fluororesin substrate laminate | Kosuke Murai, Minoru Kakitani, Makoto Yanagida, Mami Shimada | 2023-09-05 |
| 11377546 | Resin composition, laminate sheet, and multilayer printed wiring board | Tetsuroh Irino, Minoru Kakitani, Kouji Morita | 2022-07-05 |
| 11359055 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai, Hikari Murai | 2022-06-14 |
| 11339251 | Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board | Yuki Nagai, Tetsuroh Irino, Yuusuke Kondou, Tomio Fukuda, Etsuo Mizushima | 2022-05-24 |
| 11286346 | Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar | Tetsuroh Irino, Yuusuke Kondou, Yuichi Shimayama, Etsuo Mizushima, Tomio Fukuda +2 more | 2022-03-29 |
| 11041045 | Resin composition, prepreg, laminate and multilayer printed wiring board | Yuki Nagai, Yasuyuki Mizuno, Tomio Fukuda, Hikari Murai | 2021-06-22 |
| 10957964 | Multilayer transmission line plate | Tetsurou Irino, Yuusuke Kondou, Etsuo Mizushima, Tomio Fukuda, Yuki Nagai | 2021-03-23 |
| 10907029 | Resin composition, resin layer-provided support, prepreg, laminate sheet, multilayer printed wiring board, and printed wiring board for millimeter-wave radar | Tetsuroh Irino, Minoru Kakitani, Kouji Morita | 2021-02-02 |
| 10519279 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai, Hikari Murai | 2019-12-31 |
| 10506705 | Multilayer transmission line plate | Yuusuke Kondou, Etsuo Mizushima, Yuki Nagai, Tomio Fukuda, Tetsurou Irino | 2019-12-10 |
| 9828466 | Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same | Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai, Hikari Murai | 2017-11-28 |