Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12324105 | Maleimide resin composition, prepreg, resin film, laminated board, printed wiring board, and semiconductor package | Chihiro Hayashi, Minoru Kakitani, Takao Tanigawa, Naoyoshi Sato, Akira Horie | 2025-06-03 |
| 12024624 | Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package | Naoyoshi Sato, Shuji Gozu, Minoru Kakitani, Takao Tanigawa, Chihiro Hayashi | 2024-07-02 |
| 11512214 | Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductor | Kohsuke URASHIMA, Yoshinori Ejiri, Takaaki NOHDOH, Motoki YONEKURA | 2022-11-29 |