Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Hideo Nakako, Yuki KAWANA, Motoki YONEKURA, Shinichirou Sukata, Manabu Ishii +4 more | 2025-07-08 |
| 12247270 | Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses | Kunihiko Akai, Yuuhei Okada, Toshimitsu MORIYA, Shinichirou Sukata, Masayuki Miyaji | 2025-03-11 |
| 12246398 | Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump | Kunihiko Akai, Masayuki Miyaji, Junichi KAKEHATA | 2025-03-11 |
| 12233460 | Copper paste, wick formation method, and heat pipe | Hideo Nakako, Toshiaki Tanaka, Dai Ishikawa, Michiko Natori | 2025-02-25 |
| 12172240 | Solder particles | Kunihiko Akai, Yuuhei Okada, Toshimitsu MORIYA, Shinichirou Sukata, Masayuki Miyaji | 2024-12-24 |
| 12100923 | Connection structure and manufacturing method therefor | Kunihiko Akai, Masayuki Miyaji, Junichi KAKEHATA, Toshimitsu MORIYA | 2024-09-24 |
| 12070800 | Electronic component and method for manufacturing electronic component | Shinichirou Sukata, Masaya TOBA, Hideo Nakako, Yuki KAWANA, Kosuke URASHIMA +5 more | 2024-08-27 |
| 11990396 | Substrate and method for manufacturing the same | Kazuyuki MITSUKURA, Masaya TOBA, Kazuhiko Kurafuchi | 2024-05-21 |
| 11890681 | Method for producing bonded object and semiconductor device and copper bonding paste | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Chie Sugama, Yuichi Yanaka | 2024-02-06 |
| 11887960 | Member connection method | Motohiro NEGISHI, Hideo Nakako, Yuki KAWANA, Dai Ishikawa, Chie Sugama | 2024-01-30 |
| 11575076 | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module | Motohiro NEGISHI, Yuki KAWANA, Dai Ishikawa, Chie Sugama, Hideo Nakako | 2023-02-07 |
| 11562951 | Organic interposer and method for manufacturing organic interposer | Kazuyuki MITSUKURA, Masaya TOBA, Kazuhiko Kurafuchi | 2023-01-24 |
| 11532588 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2022-12-20 |
| 11512214 | Composition containing organic solvents with different vapor pressures, conductor made from composition, method for manufacturing conductor, and structure comprising conductor | Kohsuke URASHIMA, Takaaki NOHDOH, Motoki YONEKURA, Ryuji Akebi | 2022-11-29 |
| 11483936 | Method for producing joined body, and joining material | Hideo Nakako, Dai Ishikawa, Chie Sugama, Yuki KAWANA, Motohiro NEGISHI +1 more | 2022-10-25 |
| 11462502 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Dai Ishikawa, Chie Sugama | 2022-10-04 |
| 11370066 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Dai Ishikawa, Chie Sugama | 2022-06-28 |
| 11040416 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Dai Ishikawa, Yuki KAWANA, Chie Sugama, Hideo Nakako, Kazuhiko Kurafuchi | 2021-06-22 |
| 10930612 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2021-02-23 |
| 10756008 | Organic interposer and method for manufacturing organic interposer | Kazuyuki MITSUKURA, Masaya TOBA, Kazuhiko Kurafuchi | 2020-08-25 |
| 10748865 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Yuki KAWANA, Hideo Nakako, Dai Ishikawa, Chie Sugama, Kazuhiko Kurafuchi | 2020-08-18 |
| 10566304 | Assembly and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Dai Ishikawa, Chie Sugama, Yuki KAWANA | 2020-02-18 |
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Yuki KAWANA, Kazuhiko Kurafuchi, Hideo Nakako, Chie Sugama, Dai Ishikawa | 2019-07-30 |
| 9457406 | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | Hideo Nakako, Kazunori Yamamoto, Yasushi Kumashiro, Shunya Yokosawa, Katsuyuki Masuda +2 more | 2016-10-04 |
| 8997341 | Substrate for mounting semiconductor chip and method for producing same | Kiyoshi Hasegawa, Takehisa Sakurai, Yoshiaki Tsubomatsu | 2015-04-07 |