Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12247270 | Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses | Kunihiko Akai, Yoshinori Ejiri, Toshimitsu MORIYA, Shinichirou Sukata, Masayuki Miyaji | 2025-03-11 |
| 12172240 | Solder particles | Kunihiko Akai, Yoshinori Ejiri, Toshimitsu MORIYA, Shinichirou Sukata, Masayuki Miyaji | 2024-12-24 |
| 10796921 | CMP fluid and method for polishing palladium | Hisataka Minami, Ryouta Saisyo, Jin Amanokura, Hiroshi Ono | 2020-10-06 |
| 8889555 | Polishing agent for copper polishing and polishing method using same | Hiroshi Ono, Takashi Shinoda | 2014-11-18 |
| 8877644 | Polishing solution for copper polishing, and polishing method using same | Hiroshi Ono, Takashi Shinoda | 2014-11-04 |
| 8859429 | Polishing agent for copper polishing and polishing method using same | Hiroshi Ono, Takashi Shinoda | 2014-10-14 |
| 8845915 | Abrading agent and abrading method | Hiroshi Ono, Takashi Shinoda | 2014-09-30 |