Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12246398 | Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump | Masayuki Miyaji, Junichi KAKEHATA, Yoshinori Ejiri | 2025-03-11 |
| 12247270 | Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses | Yoshinori Ejiri, Yuuhei Okada, Toshimitsu MORIYA, Shinichirou Sukata, Masayuki Miyaji | 2025-03-11 |
| 12172240 | Solder particles | Yoshinori Ejiri, Yuuhei Okada, Toshimitsu MORIYA, Shinichirou Sukata, Masayuki Miyaji | 2024-12-24 |
| 12100923 | Connection structure and manufacturing method therefor | Masayuki Miyaji, Junichi KAKEHATA, Yoshinori Ejiri, Toshimitsu MORIYA | 2024-09-24 |
| 11287313 | Detecting compositions and method of using same | Shingo Kobayashi, Nobuyuki Ogawa | 2022-03-29 |
| 8480970 | Analytical pretreatment device | Hiroshi Kawazoe, Kiyoshi Yasue | 2013-07-09 |
| 8480971 | Analytical pretreatment device | Hiroshi Kawazoe, Kiyoshi Yasue | 2013-07-09 |
| 8383016 | Conductive fine particles and anisotropic conductive material | Nana Enomoto | 2013-02-26 |