Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Yoshinori Ejiri, Hideo Nakako, Yuki KAWANA, Motoki YONEKURA, Manabu Ishii +4 more | 2025-07-08 |
| 12297377 | Conductive adhesive composition, and method for producing connection structure | — | 2025-05-13 |
| 12247270 | Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses | Kunihiko Akai, Yoshinori Ejiri, Yuuhei Okada, Toshimitsu MORIYA, Masayuki Miyaji | 2025-03-11 |
| 12172240 | Solder particles | Kunihiko Akai, Yoshinori Ejiri, Yuuhei Okada, Toshimitsu MORIYA, Masayuki Miyaji | 2024-12-24 |
| 12070800 | Electronic component and method for manufacturing electronic component | Yoshinori Ejiri, Masaya TOBA, Hideo Nakako, Yuki KAWANA, Kosuke URASHIMA +5 more | 2024-08-27 |
| 9862866 | Electrically conductive adhesive composition, connection structure, solar battery module, and method for producing same | — | 2018-01-09 |
| 9837572 | Solar cell module and method of manufacturing thereof | Aya Momozaki, Shigeki Katogi, Hiroki Hayashi, Michiko Natori | 2017-12-05 |
| 8962986 | Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module | Hiroki Hayashi, Shigeki Katogi, Michiko Natori, Aya Momozaki | 2015-02-24 |