Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Yoshinori Ejiri, Hideo Nakako, Yuki KAWANA, Motoki YONEKURA, Shinichirou Sukata +4 more | 2025-07-08 |
| 12233460 | Copper paste, wick formation method, and heat pipe | Hideo Nakako, Toshiaki Tanaka, Dai Ishikawa, Yoshinori Ejiri | 2025-02-25 |
| 10201879 | Silver paste composition and semiconductor device using same | Dai Ishikawa, Hiroshi Matsumoto, Hideo Nakako, Toshiaki Tanaka | 2019-02-12 |
| 10174226 | Adhesive composition and semiconductor device using same | Hideo Nakako, Toshiaki Tanaka, Dai Ishikawa, Hiroshi Matsumoto | 2019-01-08 |
| 9837572 | Solar cell module and method of manufacturing thereof | Aya Momozaki, Shigeki Katogi, Hiroki Hayashi, Shinichirou Sukata | 2017-12-05 |
| 8962986 | Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module | Hiroki Hayashi, Shigeki Katogi, Shinichirou Sukata, Aya Momozaki | 2015-02-24 |
| 7338751 | Process for producing printed wiring board and photosensitive resin composition used in the same | Toshihiko Akahori, Ken Sawabe, Tomoaki Aoki, Takuya Kajiwara | 2008-03-04 |
| 7309559 | Resist pattern, process for producing same, and utilization thereof | Takahiro Hidaka | 2007-12-18 |