Issued Patents All Time
Showing 1–25 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12233460 | Copper paste, wick formation method, and heat pipe | Hideo Nakako, Toshiaki Tanaka, Yoshinori Ejiri, Michiko Natori | 2025-02-25 |
| 11887960 | Member connection method | Motohiro NEGISHI, Hideo Nakako, Yuki KAWANA, Chie Sugama, Yoshinori Ejiri | 2024-01-30 |
| 11784043 | Formation of SiN thin films | Toshiya Suzuki, Viljami Pore, Shang Chen, Ryoko Yamada, Kunitoshi Namba | 2023-10-10 |
| 11676812 | Method for forming silicon nitride film selectively on top/bottom portions | Atsuki Fukazawa, Eiichiro Shiba, Shinya Ueda, Taishi Ebisudani, SeungJu Chun +4 more | 2023-06-13 |
| 11575076 | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module | Motohiro NEGISHI, Yuki KAWANA, Chie Sugama, Hideo Nakako, Yoshinori Ejiri | 2023-02-07 |
| 11532588 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Chie Sugama, Yuki KAWANA | 2022-12-20 |
| 11483936 | Method for producing joined body, and joining material | Hideo Nakako, Yoshinori Ejiri, Chie Sugama, Yuki KAWANA, Motohiro NEGISHI +1 more | 2022-10-25 |
| 11462502 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Chie Sugama, Yoshinori Ejiri | 2022-10-04 |
| 11370066 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Chie Sugama, Yoshinori Ejiri | 2022-06-28 |
| 11133181 | Formation of SiN thin films | Toshiya Suzuki, Viljami Pore, Shang Chen, Ryoko Yamada, Kunitoshi Namba | 2021-09-28 |
| 11040416 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Yuki KAWANA, Chie Sugama, Hideo Nakako, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2021-06-22 |
| 10930612 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Chie Sugama, Yuki KAWANA | 2021-02-23 |
| 10910262 | Method of selectively depositing a capping layer structure on a semiconductor device structure | Aurélie Kuroda, Akiko Kobayashi | 2021-02-02 |
| 10811256 | Method for etching a carbon-containing feature | Mitsuya Utsuno, Tomohiro Kubota | 2020-10-20 |
| 10793946 | Reaction chamber passivation and selective deposition of metallic films | Delphine Longrie, Antti Niskanen, Han Wang, Qi Xie, Jan Willem Maes +4 more | 2020-10-06 |
| 10748865 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Yuki KAWANA, Hideo Nakako, Chie Sugama, Kazuhiko Kurafuchi, Yoshinori Ejiri | 2020-08-18 |
| 10720322 | Method for forming silicon nitride film selectively on top surface | Atsuki Fukazawa, Eiichiro Shiba, Shinya Ueda, Taishi Ebisudani, SeungJu Chun +4 more | 2020-07-21 |
| 10658181 | Method of spacer-defined direct patterning in semiconductor fabrication | Toshihisa Nozawa, Tomohiro Kubota | 2020-05-19 |
| 10566304 | Assembly and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Chie Sugama, Yuki KAWANA | 2020-02-18 |
| 10529554 | Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches | Atsuki Fukazawa, Eiichiro Shiba, Shinya Ueda, Taishi Ebisudani, SeungJu Chun +4 more | 2020-01-07 |
| 10480064 | Reaction chamber passivation and selective deposition of metallic films | Delphine Longrie, Antti Niskanen, Han Wang, Qi Xie, Jan Willem Maes +4 more | 2019-11-19 |
| 10468251 | Method for forming spacers using silicon nitride film for spacer-defined multiple patterning | Atsuki Fukazawa, Toshiharu Watarai | 2019-11-05 |
| 10410857 | Formation of SiN thin films | Toshiya Suzuki, Viljami Pore, Shang Chen, Ryoko Yamada, Kunitoshi Namba | 2019-09-10 |
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Yuki KAWANA, Kazuhiko Kurafuchi, Yoshinori Ejiri, Hideo Nakako, Chie Sugama | 2019-07-30 |
| 10201879 | Silver paste composition and semiconductor device using same | Hiroshi Matsumoto, Michiko Natori, Hideo Nakako, Toshiaki Tanaka | 2019-02-12 |