Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11890681 | Method for producing bonded object and semiconductor device and copper bonding paste | Yuki KAWANA, Hideo Nakako, Chie Sugama, Yoshinori Ejiri, Yuichi Yanaka | 2024-02-06 |
| 11887960 | Member connection method | Hideo Nakako, Yuki KAWANA, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2024-01-30 |
| 11575076 | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module | Yuki KAWANA, Dai Ishikawa, Chie Sugama, Hideo Nakako, Yoshinori Ejiri | 2023-02-07 |
| 11483936 | Method for producing joined body, and joining material | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA +1 more | 2022-10-25 |
| 11462502 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2022-10-04 |
| 11370066 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Dai Ishikawa, Chie Sugama, Yoshinori Ejiri | 2022-06-28 |