Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11890681 | Method for producing bonded object and semiconductor device and copper bonding paste | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Yoshinori Ejiri, Yuichi Yanaka | 2024-02-06 |
| 11887960 | Member connection method | Motohiro NEGISHI, Hideo Nakako, Yuki KAWANA, Dai Ishikawa, Yoshinori Ejiri | 2024-01-30 |
| 11575076 | Method for manufacturing thermoelectric conversion module, thermoelectric conversion module, and binder for thermoelectric conversion module | Motohiro NEGISHI, Yuki KAWANA, Dai Ishikawa, Hideo Nakako, Yoshinori Ejiri | 2023-02-07 |
| 11532588 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Yuki KAWANA | 2022-12-20 |
| 11483936 | Method for producing joined body, and joining material | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Yuki KAWANA, Motohiro NEGISHI +1 more | 2022-10-25 |
| 11462502 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Dai Ishikawa, Yoshinori Ejiri | 2022-10-04 |
| 11370066 | Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Dai Ishikawa, Yoshinori Ejiri | 2022-06-28 |
| 11040416 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Dai Ishikawa, Yuki KAWANA, Hideo Nakako, Yoshinori Ejiri, Kazuhiko Kurafuchi | 2021-06-22 |
| 10930612 | Copper paste for pressureless bonding, bonded body and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Yuki KAWANA | 2021-02-23 |
| 10748865 | Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device | Yuki KAWANA, Hideo Nakako, Dai Ishikawa, Kazuhiko Kurafuchi, Yoshinori Ejiri | 2020-08-18 |
| 10566304 | Assembly and semiconductor device | Hideo Nakako, Kazuhiko Kurafuchi, Yoshinori Ejiri, Dai Ishikawa, Yuki KAWANA | 2020-02-18 |
| 10363608 | Copper paste for joining, method for producing joined body, and method for producing semiconductor device | Yuki KAWANA, Kazuhiko Kurafuchi, Yoshinori Ejiri, Hideo Nakako, Dai Ishikawa | 2019-07-30 |