Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11890681 | Method for producing bonded object and semiconductor device and copper bonding paste | Yuki KAWANA, Hideo Nakako, Motohiro NEGISHI, Chie Sugama, Yoshinori Ejiri | 2024-02-06 |
| 11483936 | Method for producing joined body, and joining material | Hideo Nakako, Yoshinori Ejiri, Dai Ishikawa, Chie Sugama, Yuki KAWANA +1 more | 2022-10-25 |