Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10175577 | Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component | Shingo Tahara, Hiroshi Matsutani, Kouichi Abe, Akitoshi Tanimoto, Yu Aoki | 2019-01-08 |
| 9837572 | Solar cell module and method of manufacturing thereof | Aya Momozaki, Hiroki Hayashi, Michiko Natori, Shinichirou Sukata | 2017-12-05 |
| 9395626 | Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component | Akitoshi Tanimoto, Shigeru Nobe, Kei Kasuya, Hiroshi Matsutani, Yu Aoki +1 more | 2016-07-19 |
| 9309446 | Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device | Kazuyuki MITSUKURA, Takashi Kawamori, Takashi Masuko | 2016-04-12 |
| 9274422 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | Tomonori Minegishi | 2016-03-01 |
| 8962986 | Conductive adhesive, solar cell, method for manufacturing solar cell, and solar cell module | Hiroki Hayashi, Shinichirou Sukata, Michiko Natori, Aya Momozaki | 2015-02-24 |
| 8696942 | Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device | Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa | 2014-04-15 |
| 8673539 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | Takashi Kawamori, Takashi Masuko, Masaaki Yasuda | 2014-03-18 |
| 8518303 | Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device | Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa | 2013-08-27 |
| 8507323 | Method of producing semiconductor device with patterned photosensitive adhesive | Takashi Masuko, Takashi Kawamori, Kazuyuki MITSUKURA | 2013-08-13 |
| 8445177 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | Takashi Kawamori, Takashi Masuko, Masaaki Yasuda | 2013-05-21 |
| 8373283 | Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device | Takashi Masuko | 2013-02-12 |
| 8349700 | Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device | Takashi Masuko, Takashi Kawamori, Kazuyuki MITSUKURA | 2013-01-08 |
| 8323873 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | Takashi Kawamori, Takashi Masuko, Masaaki Yasuda | 2012-12-04 |
| 8309658 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi | 2012-11-13 |
| 8293453 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | Takashi Kawamori, Takashi Masuko, Masaaki Yasuda | 2012-10-23 |
| 8293847 | Film-like adhesive, adhesive sheet, and semiconductor device using same | Takashi Masuko, Minoru Sugiura, Masami Yusa | 2012-10-23 |
| 8278024 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | Takashi Kawamori, Takashi Masuko, Masaaki Yasuda | 2012-10-02 |
| 8258017 | Photosensitive adhesive | Takashi Masuko, Takashi Kawamori, Kazuyuki MITSUKURA | 2012-09-04 |
| 8138268 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Masami Yusa, Takanobu Kobayashi | 2012-03-20 |
| 7851131 | Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part | Takashi Kawamori, Takashi Masuko, Masaaki Yasuda | 2010-12-14 |
| 7795325 | Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device | Hoko Suto, Masami Yusa | 2010-09-14 |
| 7576141 | Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device | Hoko Suto, Masami Yusa | 2009-08-18 |
| 5811218 | Photoinitiator compositions including amino acids, coumarin and titanocene and photosensitive materials using the same | Makoto Kaji, Yasunori Kojima, Masataka Nunomura, Hideo Hagiwara, Dai Kawasaki +3 more | 1998-09-22 |