Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8696942 | Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device | Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Tohru Fujinawa | 2014-04-15 |
| 8518303 | Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device | Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Tohru Fujinawa | 2013-08-27 |
| 8309658 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Takanobu Kobayashi | 2012-11-13 |
| 8293847 | Film-like adhesive, adhesive sheet, and semiconductor device using same | Takashi Masuko, Minoru Sugiura, Shigeki Katogi | 2012-10-23 |
| 8138268 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | Shigeki Katogi, Houko Sutou, Hiroyuki Izawa, Toshiaki Shirasaka, Takanobu Kobayashi | 2012-03-20 |
| 8029911 | Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure | Satoyuki Nomura, Tohru Fujinawa, Hiroshi Ono, Hoko Kanazawa | 2011-10-04 |
| 7795325 | Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device | Shigeki Katogi, Hoko Suto | 2010-09-14 |
| 7781896 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2010-08-24 |
| 7771559 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | Isao Tsukagoshi, Yasushi Gotou, Yasuo Miyadera | 2010-08-10 |
| 7576141 | Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device | Shigeki Katogi, Hoko Suto | 2009-08-18 |
| 7528488 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | Isao Tsukagoshi, Yasushi Gotou, Yasuo Miyadera | 2009-05-05 |
| 7387914 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2008-06-17 |
| 7258918 | Method for connecting electrodes, surface-treated wiring board and adhesive film used in the method, and electrode-connected structure | Isao Tsukagoshi, Yasushi Gotou, Yasuo Miyadera | 2007-08-21 |
| 7208105 | Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure | Satoyuki Nomura, Tohru Fujinawa, Hiroshi Ono, Hoko Kanazawa | 2007-04-24 |
| 7141645 | Wiring-connecting material and wiring-connected board production process using the same | Tohru Fujinawa, Satoyuki Nomura, Hiroshi Ono, Itsuo Watanabe, Motohiro Arifuku +1 more | 2006-11-28 |
| 7078094 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2006-07-18 |
| 7057265 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2006-06-06 |
| 7012320 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2006-03-14 |
| 6855579 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2005-02-15 |
| 6841628 | Resin composition, adhesives prepared therewith for bonding circuit members, and circuit boards | Satoru Oota, Akira Nagai | 2005-01-11 |
| 6825249 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Shinji Takeda, Takashi Masuko, Yasuo Miyadera, Mituo Yamasaki, Iwao Maekawa +7 more | 2004-11-30 |
| 6762249 | Wiring-connecting material and process for producing circuit board with the same | Tohru Fujinawa, Satoyuki Nomura, Hiroshi Ono, Itsuo Watanabe, Motohiro Arifuku +1 more | 2004-07-13 |
| 6717242 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa +3 more | 2004-04-06 |
| 6331729 | Chip supporting substrate for semiconductor package, semiconductor device, and method for manufacturing them | Toshihiko Kato, Fumio Inoue, Shigeki Ichimura | 2001-12-18 |
| 6236108 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura +4 more | 2001-05-22 |