Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9537065 | Light-emitting device with reflective resin | Masayuki Ohta, Kazuo Tamaki, Shinji Yamaguchi, Shin Itoh, Tomoshi Kimura +1 more | 2017-01-03 |
| 9537072 | Light emitting device, lead frame and resin cavity molding package | Kazuo Tamaki | 2017-01-03 |
| 9331254 | Light emitting device | Kazuo Tamaki | 2016-05-03 |
| 8749263 | Semiconductor apparatus, inspection method thereof and electric device | Masayuki Ohta, Masaki Tatsumi, Kazuo Tamaki, Shinji Yamaguchi, Masamichi Harada +3 more | 2014-06-10 |
| 8436456 | Wiring board, semiconductor device and method for manufacturing semiconductor device | Kazuaki Tatsumi | 2013-05-07 |
| 7876572 | Wiring board and semiconductor apparatus | — | 2011-01-25 |
| RE41826 | Semiconductor device | Hisashige Nishida, Hiroyuki Juso | 2010-10-19 |
| 6979905 | Semiconductor device | Hisashige Nishida, Hiroyuki Juso | 2005-12-27 |
| RE38806 | Semiconductor device and method of manufacturing the same | Yasuki Fukui, Yuji Matsune, Atsuya Narai | 2005-10-04 |
| 6731014 | Semiconductor package substrate, semiconductor package | — | 2004-05-04 |
| 6545367 | Semiconductor package substrate, semiconductor package | — | 2003-04-08 |
| 6403895 | Wiring substance and semiconductor | — | 2002-06-11 |
| 6352879 | Semiconductor device and method of manufacturing the same | Yasuki Fukui, Yuji Matsune, Atsuya Narai | 2002-03-05 |
| 6285086 | Semiconductor device and substrate for semiconductor device | Hiroyuki Juso | 2001-09-04 |
| 6265783 | Resin overmolded type semiconductor device | Hiroyuki Juso | 2001-07-24 |
| 6250606 | Substrate for semiconductor device, semiconductor device and manufacturing method thereof | Hiroyuki Juso | 2001-06-26 |
| 6236108 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura, Yoshiaki Tsubomatsu +4 more | 2001-05-22 |
| 6229217 | Semiconductor device and method of manufacturing the same | Yasuki Fukui, Yuji Matsune, Atsuya Narai | 2001-05-08 |
| 6201707 | Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrate | — | 2001-03-13 |
| 6198165 | Semiconductor device | Yasuhisa Yamaji, Yasuki Fukui | 2001-03-06 |
| 6181002 | Semiconductor device having a plurality of semiconductor chips | Hiroyuki Juso, Tomoyo Maruyama | 2001-01-30 |
| 6100594 | Semiconductor device and method of manufacturing the same | Yasuki Fukui, Yuji Matsune, Atsuya Narai | 2000-08-08 |
| 6064111 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura, Yoshiaki Tsubomatsu +4 more | 2000-05-16 |
| 5874784 | Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor | Kazumasa Aoki | 1999-02-23 |
| 5757080 | Resin-sealed semiconductor device | — | 1998-05-26 |