Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8997341 | Substrate for mounting semiconductor chip and method for producing same | Yoshinori Ejiri, Kiyoshi Hasegawa, Takehisa Sakurai | 2015-04-07 |
| 7187072 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 2007-03-06 |
| 6746897 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 2004-06-08 |
| 6568073 | Process for the fabrication of wiring board for electrical tests | Naoki Fukutomi, Hidehiro Nakamura, Hajime Nakayama, Masanori Nakamura, Kouichi Kaitou +3 more | 2003-05-27 |
| 6365432 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 2002-04-02 |
| 6236108 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura +4 more | 2001-05-22 |
| 6223429 | Method of production of semiconductor device | Aizou Kaneda, Masaaki Yasuda, Itsuo Watanabe, Tomohisa Ohta, Fumio Inoue +9 more | 2001-05-01 |
| 6133534 | Wiring board for electrical tests with bumps having polymeric coating | Naoki Fukutomi, Hidehiro Nakamura, Hajime Nakayama, Masanori Nakamura, Kouichi Kaitou +3 more | 2000-10-17 |
| 6064111 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura +4 more | 2000-05-16 |
| 5976912 | Fabrication process of semiconductor package and semiconductor package | Naoki Fukutomi, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 1999-11-02 |
| 5664325 | Fabrication process of wiring board | Naoki Fukutomi, Hajime Nakayama, Kouichi Kaitou, Yasunobu Yoshidomi, Yoshihiro Takahashi | 1997-09-09 |
| 5504992 | Fabrication process of wiring board | Naoki Fukutomi, Toshio Yamazaki, Masahiko Itabashi, Hirohito Ohhata | 1996-04-09 |
| 5426850 | Fabrication process of wiring board | Naoki Fukutomi, Hajime Nakayama, Kouichi Kaitou, Yasunobu Yoshidomi, Yoshihiro Takahashi | 1995-06-27 |
| 4830691 | Process for producing high-density wiring board | Akinari Kida, Naoki Fukutomi, Takuya Yasuoka | 1989-05-16 |