Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7781896 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2010-08-24 |
| 7560307 | Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same | Yasuhiro Yano, Hidekazu Matsuura, Yoshihiro Nomura, Yoshii Morishita, Touichi Sakata +3 more | 2009-07-14 |
| 7387914 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2008-06-17 |
| 7078094 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2006-07-18 |
| 7061081 | Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof | Yasuhiro Yano, Hidekazu Matsuura, Yoshihiro Nomura, Yoshii Morishita, Touichi Sakata +3 more | 2006-06-13 |
| 7057265 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2006-06-06 |
| 7012320 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2006-03-14 |
| 6855579 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2005-02-15 |
| 6825249 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki +7 more | 2004-11-30 |
| 6717242 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2004-04-06 |
| 6611064 | Semiconductor device and method for manufacturing the same | Takashi Kousaka, Naoya Suzuki, Toshiaki Tanaka, Masaaki Yasuda | 2003-08-26 |
| 6404068 | Paste composition, and protective film and semiconductor device both obtained with the same | Toshiaki Tanaka, Takafumi Dohdoh, Tsutomu Kitakatsu, Masaaki Yasuda, Takashi Kousaka +1 more | 2002-06-11 |
| 6223429 | Method of production of semiconductor device | Masaaki Yasuda, Itsuo Watanabe, Tomohisa Ohta, Fumio Inoue, Yoshiaki Tsubomatsu +9 more | 2001-05-01 |
| 6099678 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Akio Kotato, Yuusuke Miyamae, Tadaji Satou, Makoto Saitou, Tooru Kikuchi +7 more | 2000-08-08 |