Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7560307 | Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same | Yasuhiro Yano, Yoshihiro Nomura, Yoshii Morishita, Touichi Sakata, Hiroshi Nishizawa +3 more | 2009-07-14 |
| 7479412 | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device | Toshiyasu Kawai | 2009-01-20 |
| 7449367 | Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device | Toshiyasu Kawai | 2008-11-11 |
| 7378722 | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device | Toshiyasu Kawai | 2008-05-27 |
| 7061081 | Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof | Yasuhiro Yano, Yoshihiro Nomura, Yoshii Morishita, Touichi Sakata, Hiroshi Nishizawa +3 more | 2006-06-13 |
| 7057266 | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device | Toshiyasu Kawai | 2006-06-06 |
| 6849385 | Photosensitive resin composition, process of forming patterns with the same, and electronic components | Tomohiro Nagoya, Takehiro Shimizu | 2005-02-01 |
| 6744133 | Adhesive film for semiconductor, lead frame and semiconductor device using the same | Yoshiyuki Tanabe | 2004-06-01 |
| 6733880 | Adhesive film for semiconductor, lead frame with adhesive film for semiconductor and semiconductor device using the same | Yoshiyuki Tanabe | 2004-05-11 |
| 6700185 | Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method for manufacturing semiconductor device | Toshiyasu Kawai | 2004-03-02 |
| 6558500 | Method of producing a lead frame with composite film attached, and use of the lead frame | Yoshihiro Nomura | 2003-05-06 |
| 6558791 | Heat-resistant adhesive sheet | Yoshihide Iwazaki, Naoto Ohta | 2003-05-06 |
| 6445076 | Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same | Takehiro Shimizu, Takafumi Dohdoh, Kazumi Tameshige, Yoshihiro Nomura, Kunihiro Tsubosaki +3 more | 2002-09-03 |
| 6372080 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | Yoshihide Iwazaki, Naoto Ohta | 2002-04-16 |
| 6302991 | Method of producing a lead frame with composite film attached, and use of the lead frame | Yoshihiro Nomura | 2001-10-16 |
| 6248613 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | Yoshihide Iwazaki, Naoto Ohta | 2001-06-19 |
| 6046072 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | Yoshihide Iwazaki, Naoto Ohta | 2000-04-04 |
| 5998020 | Composite film and lead frame with composite film attached | Yoshihiro Nomura | 1999-12-07 |
| 5958653 | Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package | Yoshihide Iwazaki | 1999-09-28 |
| 5955779 | Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package, and resist image remover | Yoshihide Iwazaki | 1999-09-21 |
| 5608013 | Polyimides and thermosetting resin compositions containing the same | Yasuo Miyadera | 1997-03-04 |
| 5530860 | Virtual computer control system effectively using a CPU with predetermined assignment ratios of resources based on a first and second priority mechanism | — | 1996-06-25 |
| 5527621 | Method for surface treatment of polyimide resin molded articles | Yasuo Miyadera | 1996-06-18 |
| 5510425 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | Yoshihide Iwasaki, Kaori Ikeda, Takayuki Suzuki, Masashi Tanaka, Yasuo Miyadera | 1996-04-23 |
| 5508357 | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of polyimides | Yoshihide Iwasaki, Kaori Ikeda, Takayuki Suzuki, Masashi Tanaka, Yasuo Miyadera | 1996-04-16 |