Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7445958 | Semiconductor device having a leading wiring layer | Shinji Suminoe, Hiroyuki Nakanishi, Toshiya Ishio, Katsunobu Mori | 2008-11-04 |
| 7091616 | Semiconductor device having a leading wiring layer | Shinji Suminoe, Hiroyuki Nakanishi, Toshiya Ishio, Katsunobu Mori | 2006-08-15 |
| 6940175 | Semiconductor device in which a plurality of electronic components are combined with each other | Toshiya Ishio, Hiroyuki Nakanishi, Katsunobu Mori | 2005-09-06 |
| 6838748 | Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof | Toshiya Ishio, Hiroyuki Nakanishi, Katsunobu Mori, Shinji Suminoe | 2005-01-04 |
| 6831002 | Manufacturing method of semiconductor device | Shinji Suminoe, Hiroyuki Nakanishi, Toshiya Ishio, Takamasa Tanaka, Katsunobu Mori | 2004-12-14 |
| 6558791 | Heat-resistant adhesive sheet | Hidekazu Matsuura, Naoto Ohta | 2003-05-06 |
| 6372080 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | Hidekazu Matsuura, Naoto Ohta | 2002-04-16 |
| 6248613 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | Hidekazu Matsuura, Naoto Ohta | 2001-06-19 |
| 6046072 | Process for fabricating a crack resistant resin encapsulated semiconductor chip package | Hidekazu Matsuura, Naoto Ohta | 2000-04-04 |
| 5958653 | Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package | Hidekazu Matsuura | 1999-09-28 |
| 5955779 | Method of forming resin film of desired pattern on semiconductor substrate, semiconductor chip, semiconductor package, and resist image remover | Hidekazu Matsuura | 1999-09-21 |