Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7445958 | Semiconductor device having a leading wiring layer | Shinji Suminoe, Hiroyuki Nakanishi, Toshiya Ishio, Yoshihide Iwazaki | 2008-11-04 |
| 7091616 | Semiconductor device having a leading wiring layer | Shinji Suminoe, Hiroyuki Nakanishi, Toshiya Ishio, Yoshihide Iwazaki | 2006-08-15 |
| 6940175 | Semiconductor device in which a plurality of electronic components are combined with each other | Yoshihide Iwazaki, Toshiya Ishio, Hiroyuki Nakanishi | 2005-09-06 |
| 6921980 | Integrated semiconductor circuit including electronic component connected between different component connection portions | Hiroyuki Nakanishi, Toshiya Ishio | 2005-07-26 |
| 6838748 | Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof | Toshiya Ishio, Hiroyuki Nakanishi, Yoshihide Iwazaki, Shinji Suminoe | 2005-01-04 |
| 6831002 | Manufacturing method of semiconductor device | Yoshihide Iwazaki, Shinji Suminoe, Hiroyuki Nakanishi, Toshiya Ishio, Takamasa Tanaka | 2004-12-14 |
| 6784528 | Semiconductor device with plating wiring connecting IC electrode pad to terminal | Hiroyuki Nakanishi, Toshiya Ishio | 2004-08-31 |
| 6552426 | Semiconductor device and method of manufacturing same | Toshiya Ishio, Hiroyuki Nakanishi | 2003-04-22 |
| 6396157 | Semiconductor integrated circuit device and manufacturing method thereof | Hiroyuki Nakanishi, Toshiya Ishio, Shinji Suminoe | 2002-05-28 |
| 6118184 | Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow | Toshiya Ishio, Hiroyuki Nakanishi, Katsuyuki Tarui | 2000-09-12 |
| 6104084 | Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads | Toshiya Ishio, Hiroyuki Nakanishi, Tomoyo Maruyama, Katsuyuki Tarui | 2000-08-15 |
| 5614760 | Tape carrier package semiconductor device | Mitsuaki Osono, Naoyuki Tajima | 1997-03-25 |
| 5604379 | Semiconductor device having external electrodes formed in concave portions of an anisotropic conductive film | — | 1997-02-18 |
| 5506444 | Tape carrier semiconductor device | Yasunori Chikawa, Yoshiaki Honda, Naoyuki Tajima, Takaaki Tsuda, Takamichi Maeda +1 more | 1996-04-09 |
| 5336650 | Method of making tape carrier semiconductor device | Yasunori Chikawa, Yoshiaki Honda, Naoyuki Tajima, Takaaki Tsuda, Takamichi Maeda | 1994-08-09 |
| 5310699 | Method of manufacturing a bump electrode | Yasunori Chikawa, Shigeyuki Sasaki, Takamichi Maeda, Masao Hayakawa | 1994-05-10 |
| 5281848 | Tape carrier semiconductor device | Yasunori Chikawa, Yoshiaki Honda, Naoyuki Tajima, Takaaki Tsuda, Takamichi Maeda | 1994-01-25 |