Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5523608 | Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package | Kouki Kitaoka, Shozo Minamide | 1996-06-04 |
| 5506444 | Tape carrier semiconductor device | Yasunori Chikawa, Yoshiaki Honda, Katsunobu Mori, Naoyuki Tajima, Takaaki Tsuda +1 more | 1996-04-09 |
| 5336650 | Method of making tape carrier semiconductor device | Yasunori Chikawa, Yoshiaki Honda, Katsunobu Mori, Naoyuki Tajima, Takaaki Tsuda | 1994-08-09 |
| 5310699 | Method of manufacturing a bump electrode | Yasunori Chikawa, Shigeyuki Sasaki, Katsunobu Mori, Masao Hayakawa | 1994-05-10 |
| 5281848 | Tape carrier semiconductor device | Yasunori Chikawa, Yoshiaki Honda, Katsunobu Mori, Naoyuki Tajima, Takaaki Tsuda | 1994-01-25 |
| 5219608 | Method of spraying release agent | Kazumasa Aoki, Kazuya Fujita, Hirofumi Uchida, Takaaki Tsuda | 1993-06-15 |
| 5153705 | Tab package and a liquid-crystal panel unit using the same | Kazuhiko Fukuta, Naoyuki Tajima, Yasunori Chikawa, Takaski Tsuda | 1992-10-06 |
| 4993618 | Wire bonding method | Kenji Toyozawa | 1991-02-19 |
| 4926239 | Plastic encapsulant for semiconductor | Kazuya Fujita, Masao Hayakawa | 1990-05-15 |
| 4536786 | Lead electrode connection in a semiconductor device | Masao Hayakawa, Masao Kumura | 1985-08-20 |
| 4383363 | Method of making a through-hole connector | Masao Hayakawa, Mituwo Oda | 1983-05-17 |
| 4300153 | Flat shaped semiconductor encapsulation | Masao Hayakawa, Masao Kumura | 1981-11-10 |
| 4280132 | Multi-lead frame member with means for limiting mold spread | Masao Hayakawa, Masao Kumura | 1981-07-21 |
| 4247590 | Ceramic plate for supporting a semiconductor wafer | Masao Hayakawa, Teruo Horii, Masao Kumura, Yasunori Chikawa | 1981-01-27 |