Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12007299 | Reusability determination method for gear and reusability determination system for gear | Tomohisa Kanazawa, Mitsuhiro Yoshimoto, Norihito Hata, Susumu Meguro, Takanobu Hiroto +1 more | 2024-06-11 |
| 10189112 | Welding equipment for metallic materials and method for welding metallic materials | Takahiko Kanai, Munehisa Hatta, Fumiaki Ikuta, Kazuhiro Kawasaki, Eizaburo Nakanishi +3 more | 2019-01-29 |
| 9498840 | Welding structural part and welding method of the same | Takahiko Kanai, Munehisa Hatta, Fumiaki Ikuta, Kazuhiro Kawasaki, Eizaburou Nakanishi +3 more | 2016-11-22 |
| 9079266 | Welding equipment for metallic materials and method for welding metallic materials | Takahiko Kanai, Munehisa Hatta, Fumiaki Ikuta, Kazuhiro Kawasaki, Eizaburo Nakanishi +3 more | 2015-07-14 |
| 8932416 | High-strength and high-ductility die-quenched parts and method of manufacturing the same | Eizaburou Nakanishi, Masayuki Miyake, Kotobu Nagai, Takehito Itagaki, Takahiko Kanai +2 more | 2015-01-13 |
| 6012474 | Mass flow control method and device utilizing a sonic nozzle | Masaki Takamoto, Shinichi Nakao, Masahiro Ishibashi, Yoshitaka Ina, Yoshikazu Yokoi | 2000-01-11 |
| 5310699 | Method of manufacturing a bump electrode | Yasunori Chikawa, Shigeyuki Sasaki, Katsunobu Mori, Takamichi Maeda | 1994-05-10 |
| 4926239 | Plastic encapsulant for semiconductor | Kazuya Fujita, Takamichi Maeda | 1990-05-15 |
| 4696452 | Trip throttle valve | Teiji Miyagawa, Yoshio Iwamura | 1987-09-29 |
| 4536786 | Lead electrode connection in a semiconductor device | Takamichi Maeda, Masao Kumura | 1985-08-20 |
| 4383363 | Method of making a through-hole connector | Takamichi Maeda, Mituwo Oda | 1983-05-17 |
| 4300153 | Flat shaped semiconductor encapsulation | Takamichi Maeda, Masao Kumura | 1981-11-10 |
| 4280132 | Multi-lead frame member with means for limiting mold spread | Takamichi Maeda, Masao Kumura | 1981-07-21 |
| 4247590 | Ceramic plate for supporting a semiconductor wafer | Takamichi Maeda, Teruo Horii, Masao Kumura, Yasunori Chikawa | 1981-01-27 |