Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6118184 | Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow | Toshiya Ishio, Hiroyuki Nakanishi, Katsunobu Mori | 2000-09-12 |
| 6104084 | Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads | Toshiya Ishio, Hiroyuki Nakanishi, Tomoyo Maruyama, Katsunobu Mori | 2000-08-15 |