TI

Toshiya Ishio

Sharp Kabushiki Kaisha: 18 patents #894 of 10,731Top 9%
Overall (All Time): #252,360 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
11239395 Image display device MASUMI MAEGAWA, Hitoshi Aoki, Katsuji Iguchi 2022-02-01
10861813 Semiconductor chip stack and method for manufacturing semiconductor chip stack 2020-12-08
8622594 Light emitting element module and manufacturing method thereof, and backlight apparatus Yasuhiko Tanaka 2014-01-07
8297784 Surface-emission unit and method for producing the same Mitsuru Hineno, Nobuo Ogata, Shinji Suminoe 2012-10-30
7906856 Semiconductor device and method for manufacturing semiconductor device 2011-03-15
7667336 Semiconductor device and method for manufacturing the same 2010-02-23
7445958 Semiconductor device having a leading wiring layer Shinji Suminoe, Hiroyuki Nakanishi, Yoshihide Iwazaki, Katsunobu Mori 2008-11-04
7091616 Semiconductor device having a leading wiring layer Shinji Suminoe, Hiroyuki Nakanishi, Yoshihide Iwazaki, Katsunobu Mori 2006-08-15
6940175 Semiconductor device in which a plurality of electronic components are combined with each other Yoshihide Iwazaki, Hiroyuki Nakanishi, Katsunobu Mori 2005-09-06
6921980 Integrated semiconductor circuit including electronic component connected between different component connection portions Hiroyuki Nakanishi, Katsunobu Mori 2005-07-26
6838748 Semiconductor element with electromagnetic shielding layer on back/side face(s) thereof Hiroyuki Nakanishi, Katsunobu Mori, Yoshihide Iwazaki, Shinji Suminoe 2005-01-04
6831002 Manufacturing method of semiconductor device Yoshihide Iwazaki, Shinji Suminoe, Hiroyuki Nakanishi, Takamasa Tanaka, Katsunobu Mori 2004-12-14
6784528 Semiconductor device with plating wiring connecting IC electrode pad to terminal Hiroyuki Nakanishi, Katsunobu Mori 2004-08-31
6552426 Semiconductor device and method of manufacturing same Hiroyuki Nakanishi, Katsunobu Mori 2003-04-22
6396157 Semiconductor integrated circuit device and manufacturing method thereof Hiroyuki Nakanishi, Katsunobu Mori, Shinji Suminoe 2002-05-28
6118184 Semiconductor device sealed with a sealing resin and including structure to balance sealing resin flow Hiroyuki Nakanishi, Katsunobu Mori, Katsuyuki Tarui 2000-09-12
6104084 Semiconductor device including a wire pattern for relaying connection between a semiconductor chip and leads Hiroyuki Nakanishi, Tomoyo Maruyama, Katsunobu Mori, Katsuyuki Tarui 2000-08-15
5793108 Semiconductor integrated circuit having a plurality of semiconductor chips Hiroyuki Nakanishi 1998-08-11