NO

Naoto Ohta

TC Toyo Tanso Co.: 7 patents #12 of 192Top 7%
HC Hitachi Chemical Company: 5 patents #314 of 1,946Top 20%
FL Fujitsu Fanuc Limited: 4 patents #27 of 96Top 30%
NI Nikon: 2 patents #1,269 of 2,493Top 55%
Overall (All Time): #251,094 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
11584651 Porous carbon and method of manufacturing same Takahiro Morishita, Hironori Orikasa, Makoto Tatsumi, Masaki Okada 2023-02-21
10357838 Graphite-copper composite electrode material and electrical discharge machining electrode using the material Masao Kanda, Kiyoshi Saito, Masaki Okada, Motoki ONISHI, Takeyuki Namiki 2019-07-23
8628748 Purification method for carbon material containing carbon nanotubes, carbon material produced by the same method, and resin molding, fiber, heat sink, slider, material for field electron emission source, conduction aid for electrode, catalyst support Yuji Takimoto, Tetsuro Tojo 2014-01-14
7816037 Anode material for lithium ion secondary battery Katsuhide Nagaoka, Kazuhito Hoshi, Hidehiko Nozaki, Tetsuro Tojo, Toshiaki Sogabe 2010-10-19
6558791 Heat-resistant adhesive sheet Hidekazu Matsuura, Yoshihide Iwazaki 2003-05-06
6489027 High purity carbon fiber reinforced carbon composites and manufacturing apparatus for use thereof Teruhisa Kondo, Toshiaki Sogabe, Toshiharu Hiraoka, Masatoshi Yamaji 2002-12-03
6432538 Carbon fiber reinforced carbon composite and useful as components for pulling single crystal apparatus Toshiharu Hiraoka, Akira Asari, Toshiaki Sogabe 2002-08-13
6399203 Pyrolytic carbon coated carbon fiber reinforced carbon composite and useful as components for pulling single crystal apparatus Teruhisa Kondo, Toshiaki Sogabe, Masatoshi Yamaji 2002-06-04
6372080 Process for fabricating a crack resistant resin encapsulated semiconductor chip package Hidekazu Matsuura, Yoshihide Iwazaki 2002-04-16
6248613 Process for fabricating a crack resistant resin encapsulated semiconductor chip package Hidekazu Matsuura, Yoshihide Iwazaki 2001-06-19
6046072 Process for fabricating a crack resistant resin encapsulated semiconductor chip package Hidekazu Matsuura, Yoshihide Iwazaki 2000-04-04
6001277 Liquid-crystal alignment film Kunihiro Ichimura, Nobuo Miyadera, Yasuo Miyadera, Yutaka Honda, Iwao Fukuchi +1 more 1999-12-14
4925282 Zoom lens assembly Hideo Kanno, Hitoshi Imanari, Hideshi Naito, Yoshiro Kodaka 1990-05-15
4806000 Zoom lens capable of macro photography Yoshiharu Shiokama, Hiroshi Okano, Kiyotaka Inadome 1989-02-21
4300079 DC Motor control system Shigeki Kawada, Yoshiki Fujioka, Yasuo Takahasi 1981-11-10
4284932 System for driving DC motor Shigeki Kawada, Yoshiki Fujioka 1981-08-18
4284939 Device for detecting opposite phase and open phase Shigeki Kawada, Yoshiki Fujioka, Yutaka Koiwai 1981-08-18
4268782 Control system for a DC motor Shigeki Kawada, Yoshiki Fujioka, Mitsuhiko Hirota 1981-05-19