Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7560307 | Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same | Yasuhiro Yano, Hidekazu Matsuura, Yoshihiro Nomura, Yoshii Morishita, Hiroshi Nishizawa +3 more | 2009-07-14 |
| 7061081 | Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof | Yasuhiro Yano, Hidekazu Matsuura, Yoshihiro Nomura, Yoshii Morishita, Hiroshi Nishizawa +3 more | 2006-06-13 |
| 6372859 | Thermoresistance adhesive and semiconductor device using the same | Hiroshi Nishizawa, Keizo Hirai, Kenji Suzuki | 2002-04-16 |
| 4791157 | Polyetheramide-imide polymer composition | Hiroshi Nishizawa, Yoshiyuki Mukoyama | 1988-12-13 |
| 4530975 | Polyamide-imide resin composition | Yoshiyuki Mukoyama, Yuichi Osada | 1985-07-23 |
| 4294952 | Polyamide-imide resin and its production | Yoshiyuki Mukoyama | 1981-10-13 |