Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7163644 | CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate | Toshihiko Akahori, Toranosuke Ashizawa, Miho Kurihara, Masato Yoshida, Yasushi Kurata | 2007-01-16 |
| 6783434 | CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate | Toshihiko Akahori, Toranosuke Ashizawa, Miho Kurihara, Masato Yoshida, Yasushi Kurata | 2004-08-31 |
| 6372859 | Thermoresistance adhesive and semiconductor device using the same | Touichi Sakata, Hiroshi Nishizawa, Kenji Suzuki | 2002-04-16 |
| 6042933 | Electric circuit device having circuit conductors using an electroconductive paste | Hiroshi Wada, Akihiro Sasaki, Hisashi Kaga, Junichi Kikuchi, Shozo Yamana +1 more | 2000-03-28 |
| 5840432 | Electroconductive paste | Hiroshi Wada, Akihiro Sasaki, Hisashi Kaga, Junichi Kikuchi, Shozo Yamana +1 more | 1998-11-24 |