Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5874518 | Epoxy-modified polyamide resin | Kenji Suzuki, Toshihiko Ito | 1999-02-23 |
| 5625026 | Amid group-containing diisocyanates and amide group-containing epoxy resins | Kenji Suzuki, Toshihiko Ito | 1997-04-29 |
| 5591813 | Amide group-containing diisocyanates and amide group-containing epoxy resins | Kenji Suzuki, Toshihiko Ito | 1997-01-07 |
| 5164816 | Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste | Hiroshi Nishizawa, Kenji Suzuki, Tohru Kikuchi, Hidetaka Sato | 1992-11-17 |
| 5087658 | Heat-resistant resin paste and integrated circuit device produced by using the heat-resistant resin paste | Hiroshi Nishizawa, Kenji Suzuki, Tohru Kikuchi, Hidetaka Sato | 1992-02-11 |
| 5047499 | Process for the production of high molecular weight polyamide-imide resin | Toichi Sakata, Kenji Hattori | 1991-09-10 |
| 5037862 | Polyamide-imide resin pastes | Hiroshi Nishizawa, Kenji Suzuki | 1991-08-06 |
| 5009949 | Resin composition and electrical laminate obtained therefrom | Kazuyuki Tanaka, Etsuji Iwami, Jun Matsuzawa, Norihiko Shibata, Akinori Hanawa +1 more | 1991-04-23 |
| 4954612 | Solvent-soluble polyimide and production thereof | Yoshihiro Nomura, Kazuhito Hanabusa, Hiroshi Minamisawa, Takashi Morinaga, Toichi Sakata +2 more | 1990-09-04 |
| 4791157 | Polyetheramide-imide polymer composition | Hiroshi Nishizawa, Touichi Sakata | 1988-12-13 |
| 4614782 | Heat resistant resin composition | Hiroshi Nishizawa, Shozo Kasai, Yasunori Okada, Yuichi Osada | 1986-09-30 |
| 4530975 | Polyamide-imide resin composition | Touichi Sakata, Yuichi Osada | 1985-07-23 |
| 4505818 | Liquid chromatographic column packing material | Osamu Hirai, Tetsuya Aoyama | 1985-03-19 |
| 4505980 | Insulated wire | Hiroshi Nishizawa, Shozo Kasai, Yasunori Okada | 1985-03-19 |
| 4497944 | Process for producing polyamide-imide resin | Hiroshi Nishizawa | 1985-02-05 |
| 4486308 | Column packing material and production thereof | Osamu Hirai, Tetsuya Aoyama | 1984-12-04 |
| 4448844 | Heat resistant resin and process for producing the same | Yuichi Osada, Shozo Kasai, Yasunori Okada, Isao Uchigasaki, Toyoji Oshima +1 more | 1984-05-15 |
| 4447589 | Method for preparing polyamide-imide resin | Hiroshi Nishizawa, Shozo Kasai | 1984-05-08 |
| 4431758 | Heat resistant resin composition comprising reaction product of polyamideimide resin, alcohol and acid component. | Yuichi Osada, Shozo Kasai, Yasunori Okada, Isao Uchigasaki, Toyoji Oshima +1 more | 1984-02-14 |
| 4427822 | Process for producing particulate polymer having imide groups | Hiroshi Nishizawa, Osamu Hirai | 1984-01-24 |
| 4353801 | Special solvent column for GPC and GPC method using the same | Nobutoshi Chikazumi, Hatuo Sugitani | 1982-10-12 |
| 4351910 | Expandable styrene series resin composition and process for production thereof | Hatuo Sugitani, Takeo Kudo, Hiromasa Kawai | 1982-09-28 |
| 4323664 | Process for producing granular polymer having uniform fine particle size | Nobutoshi Chikazumi | 1982-04-06 |
| 4294952 | Polyamide-imide resin and its production | Touichi Sakata | 1981-10-13 |