Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5212279 | Hot-melt adhesive and its use in polyimide film and printed circuit board | Yoshihiro Nomura, Takashi Morinaga, Toshiaki Fukushima, Kazuhito Hanabusa | 1993-05-18 |
| 4954612 | Solvent-soluble polyimide and production thereof | Yoshihiro Nomura, Kazuhito Hanabusa, Takashi Morinaga, Toichi Sakata, Yoshiyuki Mukoyama +2 more | 1990-09-04 |