Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4497922 | Compositions of materials for forming protective film in semiconductor device | Hidetaka Sato, Shunichiro Uchimura, Daisuke Makino | 1985-02-05 |
| 4490496 | Moistureproof insulating coating composition for packing circuit boards | Iwao Maekawa, Eiji Omori, Hideyuki Tobita, Naoki Yokoyama, Seikichi Tanno +2 more | 1984-12-25 |
| 4448844 | Heat resistant resin and process for producing the same | Yuichi Osada, Shozo Kasai, Yasunori Okada, Toyoji Oshima, Yoshiyuki Mukoyama +1 more | 1984-05-15 |
| 4431758 | Heat resistant resin composition comprising reaction product of polyamideimide resin, alcohol and acid component. | Yuichi Osada, Shozo Kasai, Yasunori Okada, Toyoji Oshima, Yoshiyuki Mukoyama +1 more | 1984-02-14 |
| 4367314 | Resin composition | Akira Kageyama, Iwao Maekawa, Takeshi Tanno | 1983-01-04 |
| 4309519 | Process for producing flyback transformer | Mitsuo Obara, Akira Kageyama | 1982-01-05 |
| 4233413 | Resin composition with low shrinkage | Noboru Monma, Iwao Maekawa, Tutomu Sarudate, Hidetaka Sato | 1980-11-11 |
| 4228251 | Resin composition having low shrink properties | Iwao Maekawa, Noboru Monma | 1980-10-14 |
| 4224430 | Resinous composition | Iwao Maekawa, Shouzi Takamizawa, Akira Kageyama | 1980-09-23 |