Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7781896 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2010-08-24 |
| 7387914 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2008-06-17 |
| 7326440 | Process for preparing an ink-jet recording material | Yukio Tokunaga | 2008-02-05 |
| 7078094 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2006-07-18 |
| 7057265 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2006-06-06 |
| 7012320 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2006-03-14 |
| 6991330 | Ink-jet recording material for proof | — | 2006-01-31 |
| 6855579 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2005-02-15 |
| 6825249 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki +7 more | 2004-11-30 |
| 6717242 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera +3 more | 2004-04-06 |
| 6099678 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Akio Kotato, Yuusuke Miyamae, Tadaji Satou, Makoto Saitou, Tooru Kikuchi +7 more | 2000-08-08 |
| 4732702 | Electroconductive resin paste | Mitsuo Yamazaki | 1988-03-22 |
| 4490496 | Moistureproof insulating coating composition for packing circuit boards | Eiji Omori, Isao Uchigasaki, Hideyuki Tobita, Naoki Yokoyama, Seikichi Tanno +2 more | 1984-12-25 |
| 4370446 | Method for manufacture of polybutadiene-modified unsaturated polyester | Tsutomu Toyoda, Hirobumi Izumi, Tadashi Fuzii | 1983-01-25 |
| 4367314 | Resin composition | Akira Kageyama, Isao Uchigasaki, Takeshi Tanno | 1983-01-04 |
| 4338427 | Process for producing polyimide-amide-carboxylic acid | Daisuke Makino | 1982-07-06 |
| 4264754 | Oligomers and a method for the manufacture thereof | Akira Kageyama | 1981-04-28 |
| 4245067 | Thermosetting resin composition | Akira Kageyama | 1981-01-13 |
| 4233413 | Resin composition with low shrinkage | Noboru Monma, Tutomu Sarudate, Hidetaka Sato, Isao Uchigasaki | 1980-11-11 |
| 4228251 | Resin composition having low shrink properties | Isao Uchigasaki, Noboru Monma | 1980-10-14 |
| 4224430 | Resinous composition | Isao Uchigasaki, Shouzi Takamizawa, Akira Kageyama | 1980-09-23 |