Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825249 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki +7 more | 2004-11-30 |
| 6099678 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Akio Kotato, Tadaji Satou, Makoto Saitou, Tooru Kikuchi, Akira Kageyama +7 more | 2000-08-08 |