Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825249 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki +7 more | 2004-11-30 |
| 6099678 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Akio Kotato, Yuusuke Miyamae, Makoto Saitou, Tooru Kikuchi, Akira Kageyama +7 more | 2000-08-08 |
| 4986869 | Method employing input and output staging chamber devices for reduced pressure lamination | Yoshiaki Tomisawa, Nobuyuki Hayashi, Yusuke Miyamae | 1991-01-22 |