Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12122467 | Moving device | Takao Murakoshi, Kenji Tsuchiya | 2024-10-22 |
| 11116029 | Mobility management entity, network entity, and method and computer readable medium therefor | Takanori Iwai, Nobuhiko Itoh, Ling Xu, Kenki Takagi, Toshiyuki Tamura +9 more | 2021-09-07 |
| 9999060 | Radio control system, communication apparatus, radio resource control method, and recording medium | Yasuhiko Matsunaga | 2018-06-12 |
| 9094160 | Base station, communication system, communication control method, and program | — | 2015-07-28 |
| 8594055 | Wireless communication system, base station, scheduling method, and program | — | 2013-11-26 |
| 8592546 | Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for same | Toshihiko Takasaki, Katsuyuki Masuda | 2013-11-26 |
| 8524921 | Liquid tetracarboxylic dianhydrides and process for the preparation thereof | Hayato Kotani, Katsuyuki Masuda, Toshihiko Takasaki | 2013-09-03 |
| 7781896 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Iwao Maekawa +3 more | 2010-08-24 |
| 7387914 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Iwao Maekawa +3 more | 2008-06-17 |
| 7078094 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Iwao Maekawa +3 more | 2006-07-18 |
| 7057265 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Iwao Maekawa +3 more | 2006-06-06 |
| 7012320 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Iwao Maekawa +3 more | 2006-03-14 |
| 6855579 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Iwao Maekawa +3 more | 2005-02-15 |
| 6825249 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki +7 more | 2004-11-30 |
| 6717242 | Semiconductor device and process for fabrication thereof | Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Iwao Maekawa +3 more | 2004-04-06 |
| 6099678 | Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device | Akio Kotato, Yuusuke Miyamae, Tadaji Satou, Makoto Saitou, Akira Kageyama +7 more | 2000-08-08 |