Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398298 | Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor device | Takahiro Kuroda, Naoki Tomori | 2025-08-26 |
| 11908762 | Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor device | Naoki Tomori, Takahiro Kuroda | 2024-02-20 |
| 11682564 | Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device | Takahiro Kuroda, Naoki Tomori | 2023-06-20 |
| 11251055 | Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor device | Takahiro Kuroda, Naoki Tomori | 2022-02-15 |
| 11195728 | Temporary protective film for semiconductor sealing molding | Naoki Tomori | 2021-12-07 |
| 7843045 | Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device | Kiyohide Tateoka, Toshiyasu Kawai, Yoshiyuki Tanabe, Naoko Tomoda | 2010-11-30 |
| 6849385 | Photosensitive resin composition, process of forming patterns with the same, and electronic components | Hidekazu Matsuura, Takehiro Shimizu | 2005-02-01 |