Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7843045 | Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device | Toshiyasu Kawai, Yoshiyuki Tanabe, Tomohiro Nagoya, Naoko Tomoda | 2010-11-30 |