Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7187072 | Fabrication process of semiconductor package and semiconductor package | Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 2007-03-06 |
| 6746897 | Fabrication process of semiconductor package and semiconductor package | Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 2004-06-08 |
| 6708398 | Substrate for use in package of semiconductor device, semiconductor package using the substrate, and methods for manufacturing the substrate and the semiconductor package | Yoshiaki Wakashima, Kazuhisa Suzuki, Takeshi Casey Funaki | 2004-03-23 |
| 6568073 | Process for the fabrication of wiring board for electrical tests | Hidehiro Nakamura, Hajime Nakayama, Yoshiaki Tsubomatsu, Masanori Nakamura, Kouichi Kaitou +3 more | 2003-05-27 |
| 6492203 | Semiconductor device and method of fabrication thereof | Yoshiaki Wakashima, Kazuhisa Suzuki, Toshio Yamazaki, Tsutomu Kitakatsu, Susumu Naoyuki +1 more | 2002-12-10 |
| 6365432 | Fabrication process of semiconductor package and semiconductor package | Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 2002-04-02 |
| 6268648 | Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device | Yoshiaki Wakashima, Susumu Naoyuki, Akinari Kida | 2001-07-31 |
| 6133534 | Wiring board for electrical tests with bumps having polymeric coating | Hidehiro Nakamura, Hajime Nakayama, Yoshiaki Tsubomatsu, Masanori Nakamura, Kouichi Kaitou +3 more | 2000-10-17 |
| 5976912 | Fabrication process of semiconductor package and semiconductor package | Yoshiaki Tsubomatsu, Fumio Inoue, Toshio Yamazaki, Hirohito Ohhata, Shinsuke Hagiwara +2 more | 1999-11-02 |
| 5664325 | Fabrication process of wiring board | Hajime Nakayama, Yoshiaki Tsubomatsu, Kouichi Kaitou, Yasunobu Yoshidomi, Yoshihiro Takahashi | 1997-09-09 |
| 5532105 | Photolithographically viahole-forming photosensitive element comprising two photosensitive layers for the fabrication process of multilayer wiring board | Takashi Yamadera, Kazumasa Takeuchi, Ritsuko Obata, Kazuko Suzuki | 1996-07-02 |
| 5504992 | Fabrication process of wiring board | Yoshiaki Tsubomatsu, Toshio Yamazaki, Masahiko Itabashi, Hirohito Ohhata | 1996-04-09 |
| 5426850 | Fabrication process of wiring board | Hajime Nakayama, Yoshiaki Tsubomatsu, Kouichi Kaitou, Yasunobu Yoshidomi, Yoshihiro Takahashi | 1995-06-27 |
| 5153987 | Process for producing printed wiring boards | Hiroshi Takahashi, Shin Takanezawa, Masao Kanno, Toshiro Okamura, Hiroyoshi Yokoyama +4 more | 1992-10-13 |
| 4830691 | Process for producing high-density wiring board | Akinari Kida, Yoshiaki Tsubomatsu, Takuya Yasuoka | 1989-05-16 |
| 4791238 | High-density wired circuit board using insulated wires | Masao Kanno, Yorio Iwasaki, Fujio Kojima, Hidehiro Nakamura | 1988-12-13 |
| 4219927 | Method of producing a multistylus head device | Yoshiyuki Tsuru, Kunio Kawaguchi, Susumu Naoyuki | 1980-09-02 |