Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5826330 | Method of manufacturing multilayer printed wiring board | Satoshi Isoda, Yasuhiro Iwasaki, Kenshirou Fukuzato, Tsutomu Zama, Koichi Noguchi +2 more | 1998-10-27 |
| 5153987 | Process for producing printed wiring boards | Hiroshi Takahashi, Shin Takanezawa, Masao Kanno, Toshiro Okamura, Naoki Fukutomi +4 more | 1992-10-13 |
| 5053280 | Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent | Shin Takanezawa, Yorio Iwasaki, Hiroshi Takaahashi, Toshiro Okamura, Saburo Amano +2 more | 1991-10-01 |
| 4585502 | Process for producing printed circuit board | Nobuo Uozu, Yoichi Matsuda | 1986-04-29 |