Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6236108 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura +4 more | 2001-05-22 |
| 6064111 | Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package | Yoshiki Sota, Koji Miyata, Toshio Yamazaki, Fumio Inoue, Hidehiro Nakamura +4 more | 2000-05-16 |
| 5929741 | Current protector | Atsushi Nishimura, Kouichi Tsuyama, Yutaka Taniguchi, Mituo Teppozuka, Wataru Shimizu +2 more | 1999-07-27 |
| 5584121 | Process for producing multiple wire wiring board | Shigeharu Arike, Eiichi Shinada, Toshiro Okamura, Kanji Murakami, Yuichi Nakazato | 1996-12-17 |
| 5486655 | Multiple wire adhesive on a multiple wire wiring board | Shigeharu Arike, Eiichi Shinada, Toshiro Okamura, Kanji Murakami, Yuichi Nakazato | 1996-01-23 |
| 5403869 | Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator | Shigeharu Arike, Eiichi Shinada, Toshiro Okamura, Kanji Murakami, Yuichi Nakazato | 1995-04-04 |
| 5323534 | Process for producing coaxial conductor interconnection wiring board | Toshiro Okamura, Shigeharu Arike, Yasushi Shimada, Hiroharu Kamiyama, Eisaku Namai +1 more | 1994-06-28 |
| 5309632 | Process for producing printed wiring board | Hiroshi Takahashi, Shin Takanezawa, Masao Kanno, Toshirou Okamura, Akishi Nakaso +1 more | 1994-05-10 |
| 5233133 | Coaxial conductor interconnection wiring board | Toshiro Okamura, Shigeharu Arike, Yasushi Shimada, Hiroharu Kamiyama, Eisaku Namai +1 more | 1993-08-03 |
| 5053280 | Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent | Shin Takanezawa, Hiroshi Takaahashi, Toshiro Okamura, Saburo Amano, Hiroyoshi Yokoyama +2 more | 1991-10-01 |
| 4791238 | High-density wired circuit board using insulated wires | Masao Kanno, Naoki Fukutomi, Fujio Kojima, Hidehiro Nakamura | 1988-12-13 |
| 4216246 | Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards | Toshiro Okamura, Akishi Nakaso, Nobuo Uozu, Hiroshi Takahashi | 1980-08-05 |