Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| PP13987 | Osteospermum plant named ‘Kakegawa AU8’ | — | 2003-07-15 |
| PP13865 | Osteospermum plant named ‘Kakegawa AU7’ | — | 2003-06-03 |
| PP12812 | Osteospermum plant named ‘Kakegawa AU4’ | — | 2002-07-30 |
| PP12795 | Osteospermum plant named ‘Kakegawa AU2’ | — | 2002-07-23 |
| PP12796 | Osteospermum plant named ‘Kakegawa AU1’ | — | 2002-07-23 |
| PP12780 | Osteospermum plant named ‘Kakegawa AU5’ | — | 2002-07-16 |
| PP12781 | Osteospermum plant named ‘Kakegawa AU6’ | — | 2002-07-16 |
| PP12778 | Osteospermum plant named ‘Kakegawa AU3’ | — | 2002-07-16 |
| 6121553 | Circuit boards using heat resistant resin for adhesive layers | Eiichi Shinada, Yuuichi Shimayama, Yoshiyuki Tsuru, Takeshi Horiuchi | 2000-09-19 |
| PP10782 | Osteospermum plant named `Seaside` | — | 1999-02-09 |
| PP10603 | Osteospermum plant named `Wildside` | — | 1998-09-15 |
| PP10596 | Osteospermum plant named `Brightside` | — | 1998-09-08 |
| PP10595 | Osteospermum plant named `Highside` | — | 1998-09-08 |
| 5309632 | Process for producing printed wiring board | Hiroshi Takahashi, Shin Takanezawa, Yorio Iwasaki, Toshirou Okamura, Akishi Nakaso +1 more | 1994-05-10 |
| 5153987 | Process for producing printed wiring boards | Hiroshi Takahashi, Shin Takanezawa, Toshiro Okamura, Naoki Fukutomi, Hiroyoshi Yokoyama +4 more | 1992-10-13 |
| 4791238 | High-density wired circuit board using insulated wires | Naoki Fukutomi, Yorio Iwasaki, Fujio Kojima, Hidehiro Nakamura | 1988-12-13 |