Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8889084 | Micro fluid system support and manufacturing method thereof | Hiroshi Kawazoe, Shigeharu Arike | 2014-11-18 |
| 8865090 | Micro fluid system support and manufacturing method thereof | Hiroshi Kawazoe, Shigeharu Arike | 2014-10-21 |
| 8028402 | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof | Hidehiro Nakamura, Shigeharu Arike, Fumio Inoue, Tetsuya Enomoto, Norio Moriike +1 more | 2011-10-04 |
| 7588835 | Method of treating the surface of copper and copper | Tomoaki Yamashita, Yasuo Inoue, Masaharu Matsuura, Toyoki Ito, Akira Shimizu +1 more | 2009-09-15 |
| 6281450 | Substrate for mounting semiconductor chips | Naoyuki Urasaki, Yasusi Simada, Yoshiyuki Tsuru, Itsuo Watanabe | 2001-08-28 |
| 6207266 | Electromagnetically shielding bonding film | Hisashige Kanbara, Minoru Tosaka | 2001-03-27 |
| 6197149 | Production of insulating varnishes and multilayer printed circuit boards using these varnishes | Kazuhito Kobayashi, Yasushi Kumashiro, Atsushi Takahashi, Koji Morita, Takahiro Tanabe +6 more | 2001-03-06 |
| 6184577 | Electronic component parts device | Kenzo Takemura, Itsuo Watanabe, Akira Nagai, Osamu Watanabe, Kazuyoshi Kojima +4 more | 2001-02-06 |
| 6153359 | Process for producing multilayer printed circuit boards | Hiroshi Shimizu, Nobuyuki Ogawa, Katsuji Shibata | 2000-11-28 |
| 5965245 | Prepreg for printed circuit board | Norio Okano, Kazuhito Kobayashi | 1999-10-12 |
| 5945258 | Process for producing multilayer printed circuit boards | Hiroshi Shimizu, Nobuyuki Ogawa, Katsuji Shibata | 1999-08-31 |
| 5879568 | Process for producing multilayer printed circuit board for wire bonding | Naoyuki Urasaki, Kouichi Tsuyama, Kazuhito Kobayashi, Norio Okano, Hiroshi Shimizu +6 more | 1999-03-09 |
| 5736065 | Chemical reducing solution for copper oxide | Youichi Kaneko | 1998-04-07 |
| 5689879 | Metal foil for printed wiring board and production thereof | Naoyuki Urasaki, Kouichi Tsuyama, Kiyoshi Hasegawa, Shuichi Hatakeyama, Akinari Kida +1 more | 1997-11-25 |
| 5690837 | Process for producing multilayer printed circuit board | Koichi Tsuyama, Kazuhisa Otsuka, Haruo Ogino, Yoshihiro Tamura, Teiichi Inada +5 more | 1997-11-25 |
| 5638598 | Process for producing a printed wiring board | Kouichi Tsuyama, Akinari Kida, Shuichi Hatakeyama, Naoyuki Urasaki | 1997-06-17 |
| 5444189 | Printed wiring board and production thereof | Kouichi Tsuyama, Akinari Kida, Shuichi Hatakeyama, Naoyuki Urasaki | 1995-08-22 |
| 5403672 | Metal foil for printed wiring board and production thereof | Naoyuki Urasaki, Kouichi Tsuyama, Kiyoshi Hasegawa, Shuichi Hatakeyama, Akinari Kida +1 more | 1995-04-04 |
| 5309632 | Process for producing printed wiring board | Hiroshi Takahashi, Shin Takanezawa, Masao Kanno, Yorio Iwasaki, Toshirou Okamura +1 more | 1994-05-10 |
| 5254156 | Aqueous solution for activation accelerating treatment | Kaoru Oginuma, Takeshi Shimazaki, Akio Takahashi | 1993-10-19 |
| 5243144 | Wiring board and process for producing the same | Haruo Ogino, Hiroharu Kamiyama | 1993-09-07 |
| 5206052 | Electroless plating process | Kaoru Oginuma, Takeshi Shimazaki, Akio Takahashi | 1993-04-27 |
| 4902551 | Process for treating copper surface | Toshiro Okamura, Haruo Ogino, Tomoko Watanabe, Yuko Kimura | 1990-02-20 |
| 4643793 | Process for treating metal surface | Youichi Kaneko, Toshiro Okamura, Kiyoshi Yamanoi | 1987-02-17 |
| 4557762 | Electroless copper plating solution | Toshiro Okamura, Kiyoshi Yamanoi, Sumiko Nakajima | 1985-12-10 |