Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8889084 | Micro fluid system support and manufacturing method thereof | Hiroshi Kawazoe, Akishi Nakaso | 2014-11-18 |
| 8865090 | Micro fluid system support and manufacturing method thereof | Hiroshi Kawazoe, Akishi Nakaso | 2014-10-21 |
| 8809696 | Method for surface treatment of copper and copper | Tomoaki Yamashita, Sumiko Nakajima, Sadao Itou, Fumio Inoue | 2014-08-19 |
| 8426742 | Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package | Yoshinori Ejiri, Shuichi Hatakeyama, Kiyoshi Hasegawa | 2013-04-23 |
| 8028402 | Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof | Hidehiro Nakamura, Akishi Nakaso, Fumio Inoue, Tetsuya Enomoto, Norio Moriike +1 more | 2011-10-04 |
| 6197149 | Production of insulating varnishes and multilayer printed circuit boards using these varnishes | Kazuhito Kobayashi, Yasushi Kumashiro, Atsushi Takahashi, Koji Morita, Takahiro Tanabe +6 more | 2001-03-06 |
| 6042685 | Multiple wire printed circuit board and process for making the same | Eiichi Shinada, Takayuki Suzuki, Yoshiyuki Tsuru | 2000-03-28 |
| 5928757 | Multiple wire printed circuit board and process for making the same | Eiichi Shinada, Takayuki Suzuki, Yoshiyuki Tsuru | 1999-07-27 |
| 5879568 | Process for producing multilayer printed circuit board for wire bonding | Naoyuki Urasaki, Kouichi Tsuyama, Kazuhito Kobayashi, Norio Okano, Hiroshi Shimizu +6 more | 1999-03-09 |
| 5690837 | Process for producing multilayer printed circuit board | Akishi Nakaso, Koichi Tsuyama, Kazuhisa Otsuka, Haruo Ogino, Yoshihiro Tamura +5 more | 1997-11-25 |
| 5688408 | Multilayer printed wiring board | Yoshiyuki Tsuru, Takashi Sugiyama, Shinjirou Miyashita, Takayuki Suzuki | 1997-11-18 |
| 5584121 | Process for producing multiple wire wiring board | Yorio Iwasaki, Eiichi Shinada, Toshiro Okamura, Kanji Murakami, Yuichi Nakazato | 1996-12-17 |
| 5562971 | Multilayer printed wiring board | Yoshiyuki Tsuru, Takashi Sugiyama, Shinjirou Miyashita, Takayuki Suzuki | 1996-10-08 |
| 5486655 | Multiple wire adhesive on a multiple wire wiring board | Yorio Iwasaki, Eiichi Shinada, Toshiro Okamura, Kanji Murakami, Yuichi Nakazato | 1996-01-23 |
| 5403869 | Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator | Yorio Iwasaki, Eiichi Shinada, Toshiro Okamura, Kanji Murakami, Yuichi Nakazato | 1995-04-04 |
| 5323534 | Process for producing coaxial conductor interconnection wiring board | Yorio Iwasaki, Toshiro Okamura, Yasushi Shimada, Hiroharu Kamiyama, Eisaku Namai +1 more | 1994-06-28 |
| 5233133 | Coaxial conductor interconnection wiring board | Yorio Iwasaki, Toshiro Okamura, Yasushi Shimada, Hiroharu Kamiyama, Eisaku Namai +1 more | 1993-08-03 |