Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426415 | Method of manufacturing an optical semiconductor device | Kanako Yuasa | 2025-09-23 |
| 12317657 | Optical semiconductor element mounting package and optical semiconductor device using the same | Kanako Yuasa | 2025-05-27 |
| 11984545 | Method of manufacturing a light emitting device | Kanako Yuasa | 2024-05-14 |
| 11810778 | Optical semiconductor element mounting package and optical semiconductor device using the same | Kanako Yuasa | 2023-11-07 |
| 10950767 | Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same | Kanako Yuasa | 2021-03-16 |
| 10381533 | Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection | Hayato Kotani, Kanako Yuasa, Akira Nagai, Mitsuyoshi Hamada | 2019-08-13 |
| 10326063 | Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same | Kanako Yuasa | 2019-06-18 |
| 10205072 | Light-emitting device and method of preparing same, optical semiconductor element mounting package, and optical semiconductor device using the same | Kanako Yuasa | 2019-02-12 |
| 9673362 | Optical semiconductor element mounting package, and optical semiconductor device using the same | — | 2017-06-06 |
| 9660156 | Optical semiconductor element mounting package, and optical semiconductor device using the same | Kanako Yuasa | 2017-05-23 |
| 9608184 | Optical semiconductor element mounting package, and optical semiconductor device using the same | Kanako Yuasa | 2017-03-28 |
| 9387608 | Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition | Hayato Kotani, Kanako Yuasa, Akira Nagai, Mitsuyoshi Hamada | 2016-07-12 |
| 9076932 | Optical semiconductor element mounting package, and optical semiconductor device using the same | Kanako Yuasa | 2015-07-07 |
| 9067906 | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate | Hayato Kotani, Makoto Mizutani | 2015-06-30 |
| 8785525 | Thermosetting light-reflecting resin composition, optical semiconductor element mounting board produced therewith, method for manufacture thereof, and optical semiconductor device | Hayato Kotani, Makoto Mizutani | 2014-07-22 |
| 8637593 | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate | Hayato Kotani, Makoto Mizutani | 2014-01-28 |
| 8585272 | Thermosetting resin composition, epoxy resin molding material, and polyvalent carboxylic acid condensate | Hayato Kotani, Makoto Mizutani | 2013-11-19 |
| 8421113 | Electronic device incorporating the white resin | Hayato Kotani | 2013-04-16 |
| 8367153 | Method of using white resin in an electronic device | Hayato Kotani | 2013-02-05 |
| 8343616 | Coating agent, substrate for mounting optical semiconductor element using same, and optical semiconductor device | Hayato Kotani | 2013-01-01 |
| 8212271 | Substrate for mounting an optical semiconductor element, manufacturing method thereof, an optical semiconductor device, and manufacturing method thereof | Hayato Kotani, Makoto Mizutani | 2012-07-03 |
| 6281450 | Substrate for mounting semiconductor chips | Yasusi Simada, Yoshiyuki Tsuru, Akishi Nakaso, Itsuo Watanabe | 2001-08-28 |
| 6197149 | Production of insulating varnishes and multilayer printed circuit boards using these varnishes | Kazuhito Kobayashi, Yasushi Kumashiro, Atsushi Takahashi, Koji Morita, Takahiro Tanabe +6 more | 2001-03-06 |
| 5879568 | Process for producing multilayer printed circuit board for wire bonding | Kouichi Tsuyama, Kazuhito Kobayashi, Norio Okano, Hiroshi Shimizu, Nobuyuki Ogawa +6 more | 1999-03-09 |
| 5689879 | Metal foil for printed wiring board and production thereof | Kouichi Tsuyama, Kiyoshi Hasegawa, Shuichi Hatakeyama, Akinari Kida, Akishi Nakaso +1 more | 1997-11-25 |