Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10662315 | Epoxy resin molding material for sealing and electronic component device | Fumio Furusawa, Ryoichi Ikezawa, Keizo Takemiya, Toru Baba | 2020-05-26 |
| 10381533 | Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection | Hayato Kotani, Naoyuki Urasaki, Kanako Yuasa, Akira Nagai | 2019-08-13 |
| 9387608 | Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition | Hayato Kotani, Naoyuki Urasaki, Kanako Yuasa, Akira Nagai | 2016-07-12 |
| 8084130 | Epoxy resin molding material for sealing and electronic component device | Akira Nagai, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa | 2011-12-27 |
| 7838671 | Nitrogen-containing organosilicon compound method of manufacture, and method of treating surfaces | Makoto Iwai | 2010-11-23 |
| 7326800 | Nitrogen-containing organosilicon compound, method of manufacture, and method of treating surfaces | Makoto Iwai | 2008-02-05 |