Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10662315 | Epoxy resin molding material for sealing and electronic component device | Mitsuyoshi Hamada, Fumio Furusawa, Ryoichi Ikezawa, Toru Baba | 2020-05-26 |
| 6372351 | Encapsulant epoxy resin composition and electronic device | Hidenori Abe | 2002-04-16 |